APU3 board version is targeted at applications that require 2 3G / LTE modems. SIM sockets can be swapped under GPIO control, enabling failover between two different networks even when only one modem is used. Another feature is the build option for a regular PCI express slot on the side


APU3A2/APU3B2/APU3C2


CPU
AMD Embedded G series GX-412TC, 1 GHz quad Jaguar corewith 64 bit and AES-NI support, 32K data + 32K instruction cache per core,shared 2MB L2 cache
DRAM
2 GB DDR3-1333 DRAM (Non-ECC)
Storage
Boot from SD card (internal sdhci controller), External USB or m-SATA SSD. 1 SATA + Power Connector. mSATA is shared withminiPCI express.
Power
12V DC, about 6 to 12W depending on CPU load. Jack = 2.5 mm, center positive
Connectivity
3 Gigabit Ethernet channels Intel i211AT
I/O
DB9 serial port, 2 USB 3.0 external + 2 USB 2.0 internal, three front panel LEDs, pushbutton
Expansion
3 miniPCI express (J14 USB or mSATA, with SIM; J15 USB only, with SIM; J16: full miniPCI express, but no SIM, intended for wifi). GPIO header, optional I2C bus, COM2 (3.3V RXD / TXD).
Board size
6 x 6" (152.4 x 152.4 mm)
Firmware
Coreboot
Cooling
Conductive cooling from the CPU to the enclosure using a 3 mm ALU Head Spreader (included)


What is the difference among APU3A2, APU3B2 and APU3C2?

Basic release of APU3 board with 2GB DRAM was APU3A2, there was issue with Fixed USB header J13 pin-out, APU3B2 board released with this fix. PCEnignes released third version of this board with model APU3C2.  Following are the changes/improvements made in APU3C2

  • Improve compatibility with LTE modem modules: Disconnect SMB_DAT / SMB_CLK signals (1.8V level on Quectel).
  • Improve compatibility with LTE modem modules: No stuff diodes D4 / D17, option resistor bypass (extremely low VIL on Huawei modems, sensitive to incoming EMI).
  • Optional SIM presence indicator / SIM card detect.
  • Disable non-functional NCT5104D watchdog timer.
  • Increase 3.3V current limit to allow for two simultaneous LTE modems.
  • Some DFM changes.


APU3A4/APU3B4/APU3C4


CPU
AMD Embedded G series GX-412TC, 1 GHz quad Jaguar corewith 64 bit and AES-NI support, 32K data + 32K instruction cache per core,shared 2MB L2 cache
DRAM
4 GB DDR3-1333 DRAM (Non-ECC)
Storage
Boot from SD card (internal sdhci controller), External USB or m-SATA SSD. 1 SATA + Power Connector. mSATA is shared withminiPCI express.
Power
12V DC, about 6 to 12W depending on CPU load. Jack = 2.5 mm, center positive
Connectivity
3 Gigabit Ethernet channels Intel i211AT
I/O
DB9 serial port, 2 USB 3.0 external + 2 USB 2.0 internal, three front panel LEDs, pushbutton
Expansion
3 miniPCI express (J14 USB or mSATA, with SIM; J15 USB only, with SIM; J16: full miniPCI express, but no SIM, intended for wifi). GPIO header, optional I2C bus, COM2 (3.3V RXD / TXD).
Board size
6 x 6" (152.4 x 152.4 mm)
Firmware
Coreboot
Cooling
Conductive cooling from the CPU to the enclosure using a 3 mm ALU Head Spreader (included)


What is the difference among APU3A2, APU3B2 and APU3C2?

Basic release of APU3 board with 4GB DRAM was APU3A4, there was issue with Fixed USB header J13 pin-out, APU3B4 board released with this fix. PCEnignes released third version of this board with model APU3C4.  Following are the changes/improvements made in APU3C4

  • Improve compatibility with LTE modem modules: Disconnect SMB_DAT / SMB_CLK signals (1.8V level on Quectel).
  • Improve compatibility with LTE modem modules: No stuff diodes D4 / D17, option resistor bypass (extremely low VIL on Huawei modems, sensitive to incoming EMI).
  • Optional SIM presence indicator / SIM card detect.
  • Disable non-functional NCT5104D watchdog timer.
  • Increase 3.3V current limit to allow for two simultaneous LTE modems.
  • Some DFM changes.



Which compatible 4G LTE modems are available?

We have AirPrime MC7455 available, advanced Cat-6 embedded module delivers up to 300 Mbps download speed and supports most 4G LTE bands in the market providing coverage for the Americas and EMEA on a single SKU. 


PCEngines APU2 Series Boards Model Overview.